07208725 is referenced by 216 patents and cites 11 patents.

Provided are optoelectronic components which include a substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, and an encapsulant filling the trench frush to the front surface, wherein the encapsulant provides an optical surface.

Title
Optoelectronic component with encapsulant
Application Number
11/124775
Publication Number
7208725 (B2)
Application Date
May 9, 2005
Publication Date
April 24, 2007
Inventor
Noel A Heiks
Radford
VA, US
David W Sherrer
Radford
VA, US
Agent
Jonathan D Baskin
Assignee
Rohm and Haas Electronic Materials
MA, US
IPC
H01J 40/14
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