07202107 is referenced by 68 patents and cites 14 patents.

A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top surfaces being provided with contact surfaces. The semiconductor wafer are divided into individual semiconductor chips, which are mounted on a carrier plate that has a thermosensitive adhesive on its top surface, such that the active top surfaces of the individual semiconductor chips are placed onto the top surface of the carrier plate. A common carrier is produced from a plastic embedding compound on the carrier plate, with the semiconductor chips being embedded in the plastic embedding compound. The carrier plate is removed by heating the thermosensitive adhesive to a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action.

Title
Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method
Application Number
11/341895
Publication Number
7202107 (B2)
Application Date
January 30, 2006
Publication Date
April 10, 2007
Inventor
Carsten Von Koblinski
Villach
AT
Holger Woerner
Regensburg
DE
Thomas Kalin
Treffen
AT
Edward Fuergut
Dasing
DE
Agent
Edell Shapiro & Finnan
Assignee
Infineon Technologies
DE
IPC
H01L 21/48
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