07149095 is referenced by 41 patents and cites 58 patents.

A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the at least one attachment site and electrically connected to at least some of the first and second contacts. The substrate is folded so that the first contacts are accessible at a bottom of a subassembly and the second contacts are accessible at a top of a subassembly. The plurality of subassemblies are stacked one on top of another in a generally vertical configuration. The substrate of at least one of the subassemblies has a plurality of attachment sites and a plurality of microelectronic elements assembled to the attachment sites. The substrate is folded so that at least some of the plurality of microelectronic elements are disposed alongside one another.

Title
Stacked microelectronic assemblies
Application Number
10/281550
Publication Number
7149095 (B2)
Application Date
October 28, 2002
Publication Date
December 12, 2006
Inventor
Vernon Solberg
Saratoga
CA, US
Belgacem Haba
Cupertino
CA, US
Young Gon Kim
Cupertino
CA, US
David Gibson
Lake Oswego
OR, US
John B Riley
Dallas
TX, US
Philip Damberg
Cupertino
CA, US
Michael Warner
San Jose
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H05K 1/11
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