The invention provides high solids epoxy-based autodeposition coating materials and a means to obtain the high solids epoxy-based autodeposition coating materials that eliminates/minimizes the need for process solvents. An epoxy pre-polymer is used. The epoxy pre-polymer is combined with ethylenically unsaturated monomer, as an alternative to organic solvent, to yield an epoxy-monomer blend, which may be blended with other coating components and additives. The resulting blend is then dispersed in water with surfactant and the ethylenically unsaturated monomer is polymerized (in the presence of other formulation components) to yield a dispersion. The dispersion may then be used as one component of a coating formulation. The coating formulation can then be applied to materials and cured to form a final coating.