07113408 is referenced by 22 patents and cites 144 patents.

A printed circuit board includes a dielectric layer and an area array of contact elements extending above a first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of a land grid array module for providing electrical connection to the land grid array module. The land grid array module can include a land grid array package or a second printed circuit board. In one embodiment, the contact elements are selected from the group of contact types including metal springs, bundled wires, metal in polymer, and solid metal tabs. In another embodiment, a contact element in the area array includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion whereby the elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer.

Title
Contact grid array formed on a printed circuit board
Application Number
10/460497
Publication Number
7113408 (B2)
Application Date
June 11, 2003
Publication Date
September 26, 2006
Inventor
John D Williams
Campbell
CA, US
Dirk D Brown
Mountain View
CA, US
Agent
Michael Bednarek
Pillsbury Winthrop Shaw Pittman
Assignee
Neoconix
CA, US
IPC
H01R 9/00
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