07091595 is referenced by 20 patents and cites 10 patents.

The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.

Title
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
Application Number
10/985051
Publication Number
7091595 (B2)
Application Date
November 10, 2004
Publication Date
August 15, 2006
Inventor
Holger Woerner
Regensburg
DE
Hermann Vilsmeier
Regensburg
DE
Edward Fuergut
Dasing
DE
Agent
Edell Shapiro & Finnan
Assignee
Infineon Technologies
DE
IPC
H01L 23/29
H01L 23/22
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