07078790 is referenced by 7 patents and cites 28 patents.

Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, at least one conductive structure is formed within a plurality of semiconductor substrates. At least portions of one of the conductive structures have oppositely facing, exposed outer surfaces. Individual substrates are stacked together in a die stack such that individual conductive structures on each substrate are in electrical contact with the conductive structures on a next adjacent substrate. In a preferred embodiment, the conductive structures comprise multi-layered, conductive pad structures.

Title
Semiconductor stacked die devices and methods of forming semiconductor stacked die devices
Application Number
11/123641
Publication Number
7078790 (B2)
Application Date
May 6, 2005
Publication Date
July 18, 2006
Inventor
Belgacem Haba
Cupertino
CA, US
Agent
Morgan Lewis & Bockius
Assignee
Rambus
CA, US
IPC
H01I 21/44
H01L 23/02
View Original Source