07071547 is referenced by 71 patents and cites 135 patents.

A stacked microelectronic assembly comprises a continuous sheet including a core panel and a plurality of side panels, each having a folded portion that connects the side panel to an edge of the core panel. At least two of the panels are at least partially horizontally aligned with one another in a stack. During manufacture of a stacked microelectronic assembly, failed microelectronic elements are identified and associated side panels thereof are simply cut-off. This results in the production of a usable stacked microelectronic assembly albeit of reduced capacity, or reduced functionality.

Title
Assemblies having stacked semiconductor chips and methods of making same
Application Number
10/655952
Publication Number
7071547 (B2)
Application Date
September 5, 2003
Publication Date
July 4, 2006
Inventor
Yoichi Kubota
Pleasanton
CA, US
Teck Gyu Kang
San Jose
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/02
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