07067911 is referenced by 102 patents and cites 176 patents.

A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies. The first semiconductor chip assembly includes a first chip, a first conductive trace and a first encapsulant, and the first conductive trace includes a first metal pillar. The second semiconductor chip assembly includes a second chip, a second conductive trace and a second encapsulant, and the second encapsulant includes a second aperture. The first metal pillar extends into the second aperture.

Title
Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture
Application Number
10/966816
Publication Number
7067911 (B1)
Application Date
October 15, 2004
Publication Date
June 27, 2006
Inventor
Cheng Lien Chiang
Taipei
TW
Charles W C Lin
Singapore
SG
Agent
David M Sigmond
Assignee
Bridge Semiconductor Corporation
TW
IPC
H01L 23/02
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