07053478 is referenced by 108 patents and cites 313 patents.

The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and its application environment. The module has a ballout pattern with a different pitch and/or supplemental module contacts devised to allow combined signaling to the integrated circuits through contacts having a desired ballout footprint. The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.

Title
Pitch change and chip scale stacking system
Application Number
10/914483
Publication Number
7053478 (B2)
Application Date
August 9, 2004
Publication Date
May 30, 2006
Inventor
Julian Dowden
Austin
TX, US
Jeff Buchle
Austin
TX, US
James Douglas Wehrly Jr
Austin
TX, US
James Wilder
Austin
TX, US
James W Cady
Austin
TX, US
David L Roper
Austin
TX, US
Agent
J Scott Denko
Andrews Kurth L
Assignee
Staktek Group
TX, US
IPC
H01L 23/02
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