07049170 is referenced by 285 patents and cites 23 patents.

A packaging substrate (310) includes a semiconductor interposer (120) and at least one other intermediate substrate (110), e.g. a BT substrate. The semiconductor interposer has first contact pads (136C) attachable to dies (124) above the interposer, and second contact pads (340) attachable to circuitry below the interposer. Through vias (330) are made in the semiconductor substrate (140) of the interposer (120). Conductive paths going through the through vias connect the first contact pads (136C) to the second contact pads (340). The second contact pads (340) protrude on the bottom surface of the interposer. These protruding contact pads (340) are inserted into vias (920) formed in the top surface of the BT substrate. The vias provide a strong mechanical connection and facilitate the interposer handling, especially if the interposer is thin. In some embodiments, an interposer or a die (124.1) has vias in the top surface. Protruding contact pads (340.1, 340.2) of another die (124.1, 124.2) are inserted into these vias to provide a strong connection.

Title
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
Application Number
10/739788
Publication Number
7049170 (B2)
Application Date
December 17, 2003
Publication Date
May 23, 2006
Inventor
Sam Kao
San Mateo
CA, US
Patrick B Halahan
San Mateo
CA, US
Sergey Savastiouk
San Jose
CA, US
Agent
MacPherson Kwok Chen & Heid
Michael Shenker
Assignee
Tru Si Technologies
CA, US
IPC
H01L 21/44
View Original Source