07037804 is referenced by 166 patents and cites 36 patents.

A three-dimensional (3-D) integrated chip system is provided with a first wafer including one or more integrated circuit (IC) devices; a second wafer including one or more integrated circuit (IC) devices; and a metal bonding layer deposited on opposing surfaces of the first and second wafers at designated locations to establish electrical connections between active IC devices on the first and second wafers and to provide metal bonding between the adjacent first and second wafers, when the first wafer is pressed against the second wafer using a flexible bladder press to account for height differences of the metal bonding layer across the opposing surfaces of the first and second wafers.

Title
Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration
Application Number
10/695328
Publication Number
7037804 (B2)
Application Date
October 27, 2003
Publication Date
May 2, 2006
Inventor
R Scott List
Beaverton
OR, US
Sarah E Kim
Portland
OR, US
Scot A Kellar
Bend
OR, US
Agent
Jay P Beale
Assignee
Intel Corporation
CA, US
IPC
H01L 21/46
H01L 21/30
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