07033861 is referenced by 66 patents and cites 423 patents.

A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and CSP are brought into proximity with each other. During solder reflow operation, a force is applied that tends to bring the combination and flex circuitry closer together. As the heat of solder reflow melts the contacts of the CSP, the combination collapses toward the flex circuitry displacing the adhesive as the solder paste and contacts merge into solder joints. In a preferred embodiment, the form standard will be devised of heat transference material, a metal, for example, such as copper would be preferred, to improve thermal performance. In other embodiments, the methods of the invention may be used to attach a CSP without a form standard to flex circuitry.

Title
Stacked module systems and method
Application Number
11/131812
Publication Number
7033861 (B1)
Application Date
May 18, 2005
Publication Date
April 25, 2006
Inventor
David Roper
Austin
TX, US
James Douglas Wehrly Jr
Austin
TX, US
Julian Partridge
Austin
TX, US
Agent
J Scott Denko
Andrews Kurth
Assignee
Staktek Group
TX, US
IPC
H01L 21/44
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