An interposer and method for making same is disclosed. A metallic sheet is formed with a plurality of spring members. A first sheet of insulative material is provided on a top surface of the metallic sheet and a second sheet of insulative material is provided on a bottom surface of the metallic sheet. The insulative material sheets each include a plurality of flaps wherein each flap at least partially corresponds to a particular one of the spring members in the metallic sheet. A conductive material is located in a predefined pattern on the first and second insulative sheets having a conductive contact portion extending onto the flaps. Vias are connected to the conductive material and extend through metallic and insulative sheets to provide electrical connectivity.