07015422 is referenced by 43 patents and cites 146 patents.

Various processes for heating semiconductor wafers is disclosed. In particular, the present invention is directed to configuring light sources emitting light energy onto a wafer in order to optimize absorption of the energy by the wafer. Optimization is carried out by varying the angle of incidence of the light energy contacting the wafer, using multiple wavelengths of light, and configuring the light energy such that it contacts the wafer in a particular polarized state. In one embodiment, the light energy can be emitted by a laser that is scanned over the surface of the wafer.

Title
System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy
Application Number
10/40272
Publication Number
7015422 (B2)
Application Date
November 7, 2001
Publication Date
March 21, 2006
Inventor
Paul Janis Timans
Mountain View
CA, US
Agent
Dority & Manning P A
Assignee
Mattson Technology
CA, US
IPC
F27B 5/14
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