07002805 is referenced by 85 patents and cites 12 patents.

A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The intermediate substrate has an opening. The first carrier and the second carrier are electrically connected to the first package and the second package respectively. The second package is accommodated in the opening and electrically connected to the first package via the first carrier, the second carrier and the intermediate carrier. The cap-like heat spreader has a supporting portion and an alignment portion wherein the supporting portion is connected to the alignment portion to define a cavity. The cavity not only accommodates the first package, the first carrier, the second package, the second carrier and the intermediate substrate but also provides alignment mechanism by the supporting portion and the alignment portion to prevent the dislocation after all the components of the thermal enhance MCM package are connected with each other. Furthermore, the first carrier has a first side and the second carrier has a second side. The first side and the second side both have grounding portions, for example recessed portions and metal layers, for providing a ground shielding of the first package and the second package against the outside. In addition, the grounding portions also provide thermal paths to increase the ability of the heat dissipation. Besides, a method for manufacturing the thermal enhance MCM package is provided.

Title
Thermal enhance MCM package and manufacturing method thereof
Application Number
10/747037
Publication Number
7002805 (B2)
Application Date
December 30, 2003
Publication Date
February 21, 2006
Inventor
Chian Chi Lin
Tainan
TW
Su Tao
Kaohsiung
TW
Shih Chang Lee
Kaohsiung
TW
Agent
Bacon & Thomas PLLC
Assignee
Advanced Semiconductor Engineering
TW
IPC
H05K 7/20
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