06971163 is referenced by 5 patents and cites 21 patents.

The attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulating purposes is described which comprises a thermosetting polymer and a chemical cross-linking agent which has fluxing properties but which is unreactive or of severely restricted reactivity with the polymer without the action of heat and/or catalyst. The composition is to be thermally curable when heated to soldering temperatures in a reaction which is catalyzable merely by metal oxide fluxed from metal surfaces by cross-linking agent then dissolved in the thermosetting polymer.

Title
Adhesive and encapsulating material with fluxing properties
Application Number
9/673992
Publication Number
6971163 (B1)
Application Date
April 22, 1999
Publication Date
December 6, 2005
Inventor
David John James Lowrie
Lincoln
GB
Hugh Patrick Craig
Gwent
GB
Agent
Sharon K Brady
Assignee
Dow Corning Corporation
MI, US
IPC
H05K 003/34
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