06970644 is referenced by 25 patents and cites 146 patents.

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Title
Heating configuration for use in thermal processing chambers
Application Number
9/747522
Publication Number
6970644 (B2)
Application Date
December 21, 2000
Publication Date
November 29, 2005
Inventor
Arieh A Strod
Cupertino
CA, US
James Tsuneo Taoka
San Jose
CA, US
Rudy Santo Tomas Cardema
San Jose
CA, US
Paul Janis Timans
Mountain View
CA, US
Shuen Chun Choy
San Francisco
CA, US
Conor Patrick O Carroll
Sunnyvale
CA, US
Zion Koren
Sunnyvale
CA, US
Agent
Dority & Manning P A
Assignee
Mattson Technology
CA, US
IPC
F26B 003/30
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