06970362 is referenced by 55 patents and cites 55 patents.

To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the die and a substrate. In an embodiment, the interposer is a multilayer ceramic structure that couples power and signal conductors on the die to corresponding conductors on the substrate. The capacitor is formed of at least one high permittivity layer and in an embodiment comprises several high permittivity layers interleaved with conductive layers. Alternatively, the capacitor can comprise at least one embedded discrete capacitor. Also described are an electronic system, a data processing system, and various methods of manufacture.

Title
Electronic assemblies and systems comprising interposer with embedded capacitors
Application Number
9/628705
Publication Number
6970362 (B1)
Application Date
July 31, 2000
Publication Date
November 29, 2005
Inventor
Kishore K Chakravorty
San Jose
CA, US
Agent
Schwegman Lundberg Woessner & Kluth P A
Assignee
Intel Corporation
CA, US
IPC
H05K 007/10
H05K 007/08
H05K 007/06
H05K 007/02
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