06965158 is referenced by 31 patents and cites 52 patents.

Multi-layer components such as circuit panels are fabricated by connecting conductive features such as traces one two or more superposed substrates using leads extending through an intermediate dielectric layer. The leads can be closely spaced to provide a high density vertical interconnection, and can be selectively connected to provide customization of the structure.

Title
Multi-layer substrates and fabrication processes
Application Number
10/167169
Publication Number
6965158 (B2)
Application Date
June 11, 2002
Publication Date
November 15, 2005
Inventor
Belgacem Haba
Cupertino
CA, US
John W Smith
Horseshoe Bay
TX, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 023/36
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