06946859 is referenced by 50 patents and cites 24 patents.

One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a substrate having contactors on a first side and pads on a second side; (b) a card having pads on a first side; and (c) interconnectors that electrically connect the pads on the second side of the substrate with the pads on the card; wherein at least one of the interconnectors includes at least a portion that does not melt at temperatures in a range from about 183° C. to about 230° C., and the distance between the substrate and the card is determined by a dimension of the at least a portion.

Title
Probe structures using clamped substrates with compliant interconnectors
Application Number
10/418512
Publication Number
6946859 (B2)
Application Date
April 16, 2003
Publication Date
September 20, 2005
Inventor
Tom T Nguyen
San Jose
CA, US
Konstantine N Karavakis
Pleasanton
CA, US
Agent
David T Millers
Assignee
Celerity Research
CA, US
IPC
H01R 012/00
G01R 031/02
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