06940158 is referenced by 38 patents and cites 13 patents.

A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for mounting to an external circuit. The first panel includes a non-overmolded microelectronic element mounted thereon. The microelectronic element having a rear face and a front face surface, wherein the front face surface confronts the obverse surface of the first panel. During manufacture the flexible sheet is folded to create a stacked microelectronic assembly such that the rear face of the first microelectronic assembly confronts and substantially contacts the obverse surface of the second panel. This results in the second panel being kept substantially flat during subsequent mounting to the external circuit.

Title
Assemblies having stacked semiconductor chips and methods of making same
Application Number
10/448515
Publication Number
6940158 (B2)
Application Date
May 30, 2003
Publication Date
September 6, 2005
Inventor
Masud Beroz
Livermore
CA, US
Belgacem Haba
Cupertino
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 023/52
H01L 023/48
H01L 023/02
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