06937037 is referenced by 66 patents and cites 198 patents.

A probe card is provided for probing a semiconductor wafer with raised contact elements. In particular, the present invention is useful with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.

Title
Probe card assembly for contacting a device with raised contact elements
Application Number
10/198198
Publication Number
6937037 (B2)
Application Date
July 16, 2002
Publication Date
August 30, 2005
Inventor
Gaetan L Mathieu
Livermore
CA, US
Gary W Grube
Pleasanton
CA, US
Benjamin N Eldridge
Danville
CA, US
Agent
N Kenneth Burraston
Assignee
Formfactor et al
CA, US
IPC
G01R 031/26
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