06930256 is referenced by 157 patents and cites 25 patents.

An integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. Conductive patterns within channels on the substrate provide interconnects that are isolated by the channel sides. A dielectric material is injection-molded or laminated over a metal layer that is punched or etched. The metal layer can provide one or more power planes within the substrate. A laser is used to ablate channels on the surfaces of the outer dielectric layer for the conductive patterns. The conductive patterns are electroplated or paste screen-printed and an etchant-resistive material is applied. Finally, a plating material can be added to exposed surfaces of the conductive patterns. An integrated circuit die and external terminals can then be attached to the substrate, providing an integrated circuit having a high-density interconnect.

Title
Integrated circuit substrate having laser-embedded conductive patterns and method therefor
Application Number
10/138225
Publication Number
6930256 (B1)
Application Date
May 1, 2002
Publication Date
August 16, 2005
Inventor
Sukianto Rusli
Phoenix
AZ, US
Ronald Patrick Huemoeller
Chandler
AZ, US
Agent
Weiss Moy & Harris P C
Assignee
Amkor Technology
AZ, US
IPC
H05K 001/16
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