06924346 is referenced by 12 patents and cites 12 patents.

Silicone resins comprising 5 to 50 mole % of (PhSiO3-x)/2(OH)x) units and 50 to 95 mole % (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.

Title
Etch-stop resins
Application Number
10/491352
Publication Number
6924346 (B2)
Application Date
October 4, 2002
Publication Date
August 2, 2005
Inventor
Craig Yeakle
Midland
MI, US
Brian Harkness
Midland
MI, US
David Ha
Midland
MI, US
Stelian Grigoras
Midland
MI, US
Ronald Boisvert
Midland
MI, US
Agent
Sharon K Brady
Assignee
Dow Corning Corporation
MI, US
IPC
H01L 021/768
C08G 077/12
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