06903443 is referenced by 150 patents and cites 57 patents.

A method for fabricating semiconductor components and interconnects includes the steps of providing a substrate, such as a semiconductor die, forming external contacts on opposing sides of the substrate by laser drilling vias through the substrate, and forming conductive members in the vias. The conductive members include enlarged terminal portions that are covered with a non-oxidizing metal. The method can be used to fabricate stackable semiconductor packages having integrated circuits in electrical communication with the external contacts. The method can also be used to fabricate interconnects for electrically engaging packages, dice and wafers for testing or for constructing electronic assemblies.

Title
Semiconductor component and interconnect having conductive members and contacts on opposing sides
Application Number
10/316349
Publication Number
6903443 (B2)
Application Date
December 11, 2002
Publication Date
June 7, 2005
Inventor
David R Hembree
Boise
ID, US
Alan G Wood
Boise
ID, US
Warren M Farnworth
Nampa
ID, US
Agent
Stephen A Gratton
Assignee
Micron Technology
ID, US
IPC
H01L 029/40
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