06902950 is referenced by 144 patents and cites 19 patents.

A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s). A portion of the encapsulation material is removed to expose a back surface of the microelectronic die which has a metallization layer disposed thereon. A protective layer is disposed on the metallization layer prior to encapsulation, such that when the portion of the encapsulation material is removed, the protective layer prevents the metallization layer from being damaged. After the portion of the encapsulation material is removed, the protective layer is removed and the metallization layer is exposed. A heat spreader may then be attached to the microelectronic die by abutting the heat spreader against the metallization layer and reflowing the metallization layer.

Title
Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby
Application Number
10/143340
Publication Number
6902950 (B2)
Application Date
May 10, 2002
Publication Date
June 7, 2005
Inventor
Quat T Vu
Santa Clara
CA, US
Xiao Chun Mu
Saratoga
CA, US
Qing Ma
San Jose
CA, US
Agent
Schwegman Lundberg Woessner & Kluth P A
Assignee
Intel Corporation
CA, US
IPC
H05K 003/46
H01L 023/12
H01L 021/44
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