06902941 is referenced by 100 patents and cites 6 patents.

A new and improved method for the probing of integrated circuits (ICs) and is particularly suitable for probing various elements of an IC for failure analysis or other electrical testing and/or measurement of the IC. The method includes providing a probe access trench in the IMD (intermetal dielectric) or other substrate adjacent to the circuit element to be tested and then providing direct electrical contact between the test probe and the sidewall of the element through the trench, during the testing process. Such direct electrical contact between the test probe and the sidewall of the element prevents excessively high contact resistance which may otherwise occur in the use of a probing pad between the test probe and the element.

Title
Probing of device elements
Application Number
10/386088
Publication Number
6902941 (B2)
Application Date
March 11, 2003
Publication Date
June 7, 2005
Inventor
Luen Chian Sun
Kaohsiung
TW
Agent
Tung & Associates
Assignee
Taiwan Semiconductor Manufacturing
TW
IPC
H01L 021/66
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