06894399 is referenced by 63 patents and cites 64 patents.

A microelectronic device includes a microelectronic die having an interfacial metal layer deposited over an active surface thereof to perform a signal distribution function within the device. The microelectronic die is fixed within a package core to form a die/core assembly. One or more metallization layers may then be built up over the die/core assembly as part of a packaging scheme. The interfacial metal layer can be applied either before or after the die is fixed within the package core. In one approach, the interfacial layer is applied during wafer-level processing.

Title
Microelectronic device having signal distribution functionality on an interfacial layer thereof
Application Number
9/845881
Publication Number
6894399 (B2)
Application Date
April 30, 2001
Publication Date
May 17, 2005
Inventor
Steven Towle
Phoenix
AZ, US
Tuy T Ton
San Jose
CA, US
Quat T Vu
Santa Clara
CA, US
Agent
Schwegman Lundberg Woessner & Kluth P A
Assignee
Intel Corporation
CA, US
IPC
H01L 023/28
H01L 021/82
H01L 023/12
H05K 003/46
H01L 023/12
H01L 023/12
H01L 021/60
H01L 023/48
H01L 023/50
H01L 021/00
H01L 021/60
H01L 023/538
H01L 021/58
H01L 023/15
H01L 023/498
H01L 023/522
H05K 003/28
H01L 029/40
H01L 023/52
H01L 023/48
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