06887723 is referenced by 77 patents and cites 65 patents.

Methods for processing at least one die which comprises an integrated circuit. In one example of a method of the invention, an identification code is applied to a carrier. A singulated die is deposited into the carrier which holds the singulated die. The singulated die comprises an integrated circuit. The identification code may be applied to the carrier before or after depositing the singulated die into the carrier. The carrier may be used in testing the singulated die and may include a plurality of singulated die or just one singulated die. In another example of a method of the invention, an identification code is applied to a die. The die is deposited into a carrier which holds the die. The die comprises an integrated circuit, and the carrier holds the die in singulated form. Typically the die is placed in the carrier without any packaging which may protect the die. The identification code may be applied to the die before or after it is deposited into the carrier.

Title
Method for processing an integrated circuit including placing dice into a carrier and testing
Application Number
9/260794
Publication Number
6887723 (B1)
Application Date
March 1, 1999
Publication Date
May 3, 2005
Inventor
David V Pederson
Scotts Valley
CA, US
Douglas S Ondricek
Lafayette
CA, US
Agent
N Kenneth Burraston
Blakely Sokoloff Taylor & Zafman
Assignee
FormFactor
CA, US
IPC
H01L 021/50
H01L 021/18
H01L 021/44
H01L 021/66
G01R 031/26
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