06878206 is referenced by 166 patents and cites 447 patents.

A lid assembly for a semiconductor processing system is provided. The lid assembly generally includes a lid having a gas manifold mounted on a first side and a baffle plate mounted on a second side. The gas manifold is configured to deliver a plurality of gases to a plenum defined between the baffle plate and the lid. The gases are mixed within a recess formed in the baffle plate before exiting into the processing system through a singular passage.

Title
Lid assembly for a processing system to facilitate sequential deposition techniques
Application Number
10/16300
Publication Number
6878206 (B2)
Application Date
December 12, 2001
Publication Date
April 12, 2005
Inventor
Salvador P Umotoy
Antioch
CA, US
Gwo Chuan Tzu
Sunnyvale
CA, US
Agent
Moser Patterson Sheridan
Assignee
Applied Materials
CA, US
IPC
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