06872579 is referenced by 1 patents and cites 24 patents.

A method of forming a patterned thin film comprises the steps of forming a first plating layer and a second plating layer. Each of the steps of forming the plating layers includes: the step of forming a coating film by applying a liquid resist to the layer below; the heat processing step of forming a resist layer by performing heat processing on the coating film; the step of forming a frame by patterning the resist layer; and the step of forming the plating layer by plating through the use of the frame. Each of sublayers includes: a first portion having a sidewall and encased in a groove of the frame; and the second portion extending out of the groove. The second portion has overhang portions that overhang and extend more outward than the sidewall of the first portion.

Thin-film coil and method of forming same
Application Number
Publication Number
6872579 (B2)
Application Date
July 9, 2003
Publication Date
March 29, 2005
Akifumi Kamijima
Oliff & Berridge
TDK Corporation
H01L 021/76
H01L 039/00
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