06870271 is referenced by 24 patents and cites 8 patents.

One embodiment of the present invention provides an integrated circuit assembly module, including a first semiconductor die and a second semiconductor die, each semiconductor die with an active face upon which active circuitry and signal pads reside and a back face opposite the active face. The first and second semiconductor dies are positioned face-to-face within the assembly module so that signal pads on the first semiconductor die overlap with signal pads on the second semiconductor die, thereby facilitating capacitive communication between the first and second semiconductor dies. Additionally, the first and second semiconductor dies are pressed together between a first substrate and a second substrate so that a front side of the first substrate is in contact with the back face of the first semiconductor die and a front side of the second substrate is in contact with the back face of the second semiconductor die.

Title
Integrated circuit assembly module that supports capacitive communication between semiconductor dies
Application Number
10/671642
Publication Number
6870271 (B2)
Application Date
September 26, 2003
Publication Date
March 22, 2005
Inventor
Howard L Davidson
San Carlos
CA, US
Gary R Lauterbach
Los Altos Hills
CA, US
Robert J Drost
Mountain View
CA, US
Ivan E Sutherland
Santa Monica
CA, US
Agent
Park Vaughan & Fleming
Assignee
Sun Microsystems
CA, US
IPC
H05K 007/00
H01L 023/52
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