06867471 is referenced by 15 patents and cites 20 patents.

An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of a metal-clad base plate. Ideally, a panel having a number of component positions is provided for receiving a number of such an electronic component.

Title
Universal package for an electronic component with a semiconductor chip and method for producing the universal package
Application Number
10/652362
Publication Number
6867471 (B2)
Application Date
August 29, 2003
Publication Date
March 15, 2005
Inventor
Holger W├Ârner
Regensburg
DE
Stefan Wein
Regensburg
DE
Christian Stuempfl
Schwandorf
DE
Gerald Ofner
Bad Abbach
DE
Robert Christian Hagen
Sarching
DE
Bernd Goller
Otterfing
DE
Agent
Gregory L Mayback
Werner H Stemer
Laurence A Greenberg
Assignee
Infineon Technologies
DE
IPC
H01L 029/72
H01L 021/4763
H01L 021/04
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