06849545 is referenced by 28 patents and cites 207 patents.

A system and method to form a stacked barrier layer for copper contacts formed on a substrate. The substrate is serially exposed to first and second reactive gases to form an adhesion layer. Then, the adhesion layer is serially exposed to third and fourth reactive gases to form a barrier layer adjacent to the adhesion layer. This is followed by deposition of a copper layer adjacent to the barrier layer.

Title
System and method to form a composite film stack utilizing sequential deposition techniques
Application Number
9/885609
Publication Number
6849545 (B2)
Application Date
June 20, 2001
Publication Date
February 1, 2005
Inventor
Moris Kori
Palo Alto
CA, US
Ashok Sinha
Palo Alto
CA, US
Hua Chung
San Jose
CA, US
Jeong Soo Byun
Cupertino
CA, US
Mei Chang
Saratoga
CA, US
Alfred W Mak
Union City
CA, US
Agent
Moser Patterson & Sheridan
Assignee
Applied Materials
CA, US
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