06847529 is referenced by 15 patents and cites 152 patents.

A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Title
Ultra-low impedance power interconnection system for electronic packages
Application Number
10/36957
Publication Number
6847529 (B2)
Application Date
December 20, 2001
Publication Date
January 25, 2005
Inventor
Edward J Derian
San Diego
CA, US
Carl E Hoge
San Diego
CA, US
David H Hartke
Durango
CO, US
Joseph Ted Dibene II
Oceanside
CA, US
Agent
Knobbe Martens Olson & Bear
Assignee
INCEP Technologies
CA, US
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