06847527 is referenced by 45 patents and cites 36 patents.

An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.

Title
Interconnect module with reduced power distribution impedance
Application Number
10/199926
Publication Number
6847527 (B2)
Application Date
July 19, 2002
Publication Date
January 25, 2005
Inventor
William G Petefish
Chippewa Falls
WI, US
David A Hanson
Eau Claire
WI, US
Mark F Sylvester
Fall Creek
WI, US
Agent
Melanie G Gover
Assignee
3M Innovative Properties Company
MN, US
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