06847109 is referenced by 78 patents and cites 13 patents.

An area array type semiconductor package suitable for use in the formation of a 3-dimensional stack of the area array type packages. The area array type semiconductor package includes a circuit board, typically a tape circuit board, a semiconductor chip, bonding wires, an encapsulation body, solder posts, and solder balls. A plurality of the area array type semiconductor packages can be electrically connected through the corresponding solder balls and solder posts on adjacent packages to form semiconductor stack packages.

Title
Area array semiconductor package and 3-dimensional stack thereof
Application Number
10/406447
Publication Number
6847109 (B2)
Application Date
April 4, 2003
Publication Date
January 25, 2005
Inventor
Jong Bo Shim
Cheonan
KR
Agent
Harness Dickey & Pierce
Assignee
Samsung Electronics
KR
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