06845013 is referenced by 11 patents and cites 137 patents.

The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.

Title
Right-angle power interconnect electronic packaging assembly
Application Number
10/384057
Publication Number
6845013 (B2)
Application Date
March 4, 2003
Publication Date
January 18, 2005
Inventor
J Ted DiBene II
Oceanside
CA, US
David H Hartke
Durango
AZ, US
Agent
Knobbe Martens Olson & Bear
Assignee
Incep Technologies
CA, US
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