06822320 is referenced by 8 patents and cites 4 patents.

An electrically conductive article such as a sheet having holes therein is coated with a dielectric polymer using a multi-stage electrophoretic deposition process. A coating of uncured polymer is deposited electrophoretically and then cured. After the first polymer is cured, the part is subject to a further electrophoretic deposition process and further curing. Use of a second electrophoretic deposition step allows effective coating of parts having small holes without plugging the holes. The coated parts may be used as microelectronic connection components such as chip carriers used in packaging semiconductor chips.

Title
Microelectronic connection components utilizing conductive cores and polymeric coatings
Application Number
10/254926
Publication Number
6822320 (B2)
Application Date
September 25, 2002
Publication Date
November 23, 2004
Inventor
Belgacem Haba
Cupertino
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
US
Assignee
Tessera
CA, US
IPC
H01L 23/02
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