06803663 is referenced by 31 patents and cites 9 patents.
An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (
10
) having a semiconductor chip (
12
) with electrodes (
16
), a stress-relieving layer (
14
) prepared on the semiconductor chip (
12
), a wire (
18
) formed across the electrodes (
16
) and the stress-relieving layer (
14
), and solder balls (
19
) formed on the wire (
18
) over the stress-relieving layer (
14
); and a bare chip (
20
) as a second semiconductor device to be electrically connected to the first semiconductor device (
10
).
Citations: 31 (view full list)
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