06710455 is referenced by 28 patents and cites 2 patents.

An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from them to the carrier substrate. A method for fabricating the component is also described.

Title
Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component
Application Number
10/231881
Publication Number
6710455 (B2)
Application Date
August 30, 2002
Publication Date
March 23, 2004
Inventor
Stefan Wein
Regensburg
US
Christian Stümpfl
Schwandorf
US
Robert Christian Hagen
Sarching
US
Holger Wörner
Regensburg
US
Josef Thumbs
Breitenbrunn
US
Gerald Ofner
Bad Abbach
US
Bernd Goller
Kemnath
US
Agent
Ralph E Locher
US
Werner H Stemer
US
Laurence A Greenberg
US
Assignee
Infineon Technologies
US
IPC
H01L 23/48
View Original Source