06706571 is referenced by 472 patents.

A method of forming multiple structures in a semiconductor device includes depositing a film over a conductive layer, etching a trench in a portion of the film and forming adjacent the sidewalls of the trench. The film may then be etched, followed by an of the conductive layer to form the structures.

Title
Method for forming multiple structures in a semiconductor device
Application Number
10/274951
Publication Number
6706571 (B1)
Application Date
October 22, 2002
Publication Date
March 16, 2004
Inventor
Haihong Wang
Fremont
CA, US
Cyrus E Tabery
Sunnyvale
CA, US
Judy Xilin An
San Jose
CA, US
Bin Yu
Cupertino
CA, US
Agent
Harrity & Snyder
US
Assignee
Advanced Micro Devices
CA, US
IPC
H01L 21/00
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