06630201 is referenced by 208 patents and cites 3 patents.

A method for conducting an ALD process to deposit layers on a substrate which includes an electrostatic chuck (ESC) to retain the substrate. Electrode(s) in the chuck assembly are used to induce a voltage on the substrate to promote precursor adsorption on the substrate.

Title
Adsorption process for atomic layer deposition
Application Number
9/999636
Publication Number
6630201 (B2)
Application Date
October 24, 2001
Publication Date
October 7, 2003
Inventor
Jason E Babcoke
Menlo Park
CA, US
Jeffrey A Brown
San Francisco
CA, US
Karl F Leeser
Sunnyvale
CA, US
Tony P Chiang
Santa Clara
CA, US
Agent
Patent Law Group
US
Agent
Brian D Ogonowsky
US
Assignee
Angstron Systems
CA, US
IPC
C23C 16/00
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