06620731 is referenced by 161 patents.

A method for fabricating semiconductor components and interconnects includes the steps of providing a substrate, such as a semiconductor die, forming external contacts on opposing sides of the substrate by laser drilling vias through the substrate, and forming conductive members in the vias. The conductive members include enlarged terminal portions that are covered with a non-oxidizing metal. The method can be used to fabricate stackable semiconductor packages having integrated circuits in electrical communication with the external contacts. The method can also be used to fabricate interconnects for electrically engaging packages, dice and wafers for testing or for constructing electronic assemblies.

Title
Method for fabricating semiconductor components and interconnects with contacts on opposing sides
Application Number
10/35355
Publication Number
6620731 (B1)
Application Date
January 4, 2002
Publication Date
September 16, 2003
Inventor
David R Hembree
Boise
ID, US
Alan G Wood
Boise
ID, US
Warren M Farnworth
Nampa
ID, US
Agent
Stephen A Gratton
US
Assignee
Micron Technology
ID, US
IPC
H01L 21/44
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