06611316 is referenced by 289 patents.

The present invention provides a method and system for simultaneously imaging at least two reticles onto a substrate. According to the present invention, the wafer is passed through the exposure sequence once with images from the reticles being exposed simultaneously onto the wafer. The throughput of the system is effectively maintained at the standard single pass throughput level or twice that of conventional systems. In one embodiment, the present invention produces two reticle images side-by-side in the exit pupil of the optics of a step and scan wafer exposure system. The scanning action of the exposure tool then effectively superimposes the two images during the exposure of the wafer. Each image exposes the photoresist as the wafer is scanned through the image field synchronously with the scanning of the reticles. According to one embodiment, the image scanning is synchronized so that two required images are superimposed. According to another embodiment, the two images can be independently focused and aligned.

Title
Method and system for dual reticle image exposure
Application Number
10/83667
Publication Number
6611316 (B2)
Application Date
February 27, 2002
Publication Date
August 26, 2003
Inventor
Harry Sewell
Ridgefield
CT, US
Agent
Sterne Kessler Goldstein & Fox PLLC
US
Assignee
ASML Holding
CT, US
IPC
G03B 27/44
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