06578754 is referenced by 314 patents and cites 3 patents.

A flip chip interconnect system comprises and elongated pillar comprising two elongated portions, one portion including copper and another portion including solder. The portion including copper is in contact with the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of &agr; particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.

Title
Pillar connections for semiconductor chips and method of manufacture
Application Number
9/564382
Publication Number
6578754 (B1)
Application Date
April 27, 2000
Publication Date
June 17, 2003
Inventor
Francisca Tung
Austin
TX, US
Agent
Stephen B Ackerman
US
George O Saile
US
Assignee
Advanpack Solutions
US
IPC
B23K 35/14
View Original Source