06560117 is referenced by 277 patents.

Packaged microelectronic devices, interface substrates for packaging microelectronic devices, and methods of packaging single-die or stacked-die devices. One embodiment can include a die, an interface member having a die section attached to the die and an array section, and a casing encapsulating at least a portion of the die. The die section has a plurality of contacts coupled to bond-pads on the die, and the array section has an array of ball-pads coupled to the contacts by interconnecting circuitry in the interface member. The array section is folded over and/or under the die section, and the array section is attached to a backside of the die and/or a surface of the casing.

Title
Packaged microelectronic die assemblies and methods of manufacture
Application Number
9/944723
Publication Number
6560117 (B2)
Application Date
August 30, 2001
Publication Date
May 6, 2003
Inventor
Ow Chee Moon
Singapore
US
Agent
Perkins Coie
US
Assignee
Micron Technology
ID, US
IPC
H05K 1/00
View Original Source