06555908 is referenced by 117 patents.

Structures and methods are provided for electrically interconnecting and absorbing stress between a first electrical structure and a second electrical structure. In one embodiment, non-conductive compliant bumps are disposed on at least one of the structures and a metal layer is provided over a surface of the non-conductive compliant bumps. The metal layer facilitates electrical coupling of the metal on the surfaces of the compliant bumps with multiple contact pads of the structure supporting the bumps. The non-conductive compliant bumps can be fabricated of a low modulus material which has a high ultimate elongation property (LMHE dielectric). The LMHE dielectric can have a Young's modulus of less than 50,000 psi and an ultimate elongation property of at least twenty percent. In an alternate embodiment, at least one mushroom-shaped conductive bump is disposed above a compliant dielectric layer on one of the first electrical structure or the second electrical structure. The mushroom-shaped conductive bumps are employed to electrically interconnect the first and second electrical structures. The compliant dielectric layer can be a LMHE dielectric.

Title
Compliant, solderable input/output bump structures
Application Number
9/501177
Publication Number
6555908 (B1)
Application Date
February 10, 2000
Publication Date
April 29, 2003
Inventor
James E Kohl
Reading
MA, US
Charles W Eichelberger
Wakefield
MA, US
Agent
Heslin Rothenberg Farley & Mesiti P C
US
Agent
Kevin P Radigan Esq
US
Assignee
EPIC Technologies
MA, US
IPC
H01L 23/34
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