06541107 is referenced by 178 patents and cites 5 patents.

Nanoporous silicone resins and silicone resin films having low dielectric constants and a method for preparing such nanoporous silicone resins. The silicone resin comprises the reaction product of a mixture comprising

(A) 15-70 mol % of a tetraalkoxysilane described by formula

Si(OR

1

)

4

,

 where each R

1

is an independently selected alkyl group comprising 1 to about 6 carbon atoms,

(B) 12 to 60 mol % of a hydrosilane described by formula

HSiX

3

,

 where each X is an independently selected hydrolyzable substituent,

(C) 15 to 70 mole percent of an organotrialkoxysilane described by formula

R

2

Si(OR

3

)

3

,

 where R

2

is a hydrocarbon group comprising about 8 to 24 carbon atoms or a substituted hydrocarbon group comprising a hydrocarbon chain having about 8 to 24 carbon atoms and each R

3

is an independently selected alkyl group comprising 1 to about 6 carbon atoms; in the presence of

(D) water,

(E) hydrolysis catalyst, and

(F) organic solvent for the reaction product.

The silicone resin is cured and heated in an inert atmosphere at a temperature sufficient to effect thermolysis of carbon-carbon bonds of the R

2

groups thereby forming a nanoporous silicone resin.

Title
Nanoporous silicone resins having low dielectric constants
Application Number
9/425901
Publication Number
6541107 (B1)
Application Date
October 25, 1999
Publication Date
April 1, 2003
Inventor
Shizhong Zhang
Midland
MI, US
Kyuha Chung
Midland
MI, US
Russell Keith King
Midland
MI, US
Bianxiao Zhong
Midland
MI, US
Agent
Sharon K Severance
US
Rick D Streu
US
William F Boley
US
Assignee
Dow Corning Corporation
MI, US
IPC
B32B 3/26
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